• 5 high speed SMD lines each producing at 60,000 part placements per hour
• Surface mount assembly equipment can accommodate component sizes from 0201s through a maximum package size of 74 mm. square at accuracies to +/- 0.025 mm.
• Fine pitch placement to 0.15 mm.
• BGA’s and micro-BGA’s are accurately placed using the high-resolution gray scale vision processing system.
• POP Assembly(Part on Part Assembly)

Automated optical Inspection (AOI)

The inspection relies on state-of-the-art technology for printed circuit board inspection that replaces manual visual inspection. Therefore the automated inspection machine can assure a consistent product every time. Our AOI machines offer full defect coverage at the highest throughput. By combining multiple cameras and camera angles assemblies can be inspected for placement, solder joint quality and a variety of other defects. AOI accomplishes a typical cycle gain of 80%.

X-Ray Systems

Circuit Pak provides X-Ray inspection capabilities to ensure quality standards are met for BGA’s, Flip Chips, and other high density packages.

The In-Circuit Test (ICT) exists to test, detect, and locate electronic circuit board faults.

In-circuit test equipment operates by measuring each component to check that it is in place and of the correct value.

• The Agilent 3070 provides superior test coverage, accuracy, and repeatability.
• The 3070 provides the most versatile and flexible analog and digital testing capability of any in-circuit test system on the market today allowing us to electrically test today’s most complex digital devices.

• Confomal Coating
• 2D Laser Etching
• Box Build
• Tab Routing
• PCB Depanelizing